|By PR Newswire||
|January 21, 2013 06:52 AM EST||
NEW YORK, Jan. 21, 2013 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
A 2X GROWTH IS EXPECTED IN THE NEXT 5 YEARS WITHIN THE ELECTRONICS INDUSTRY
From a commodity technology initially developed to replace bulky discrete passive components, thin-film Integrated Passive Devices (IPDs) are now a growing industry trend driven by RF, High Brightness LEDs, ESD and EMI protection, and Digital and Mixed Signal applications. This new research study on thin-film Integrated Passive and Active Devices estimates the total IPD market to grow from more than $610M this year to over $1.2B by 2017 with a CAGR of 12%.
ESD and EMI protection IPD revenues are stabilizing, primarily due to the recent decline of NOKIA in the mobile space. NOKIA has been the main driving OEM for the integration of IPDs in volume, with many handsets having from 10 to 15 ESD and EMI protection IPDs per system. It remains to be seen which OEMs will take over NOKIA's leadership in the integration of IPDs? If Sony-Ericsson and Motorola have adopted the technology to limited volume, Apple recently started to adopt more and more IPD components into its end-products, while Samsung recently has been quite conservative in adopting this technology.
With a CAGR of almost 25%, the ESD and TVS protection of high power LED will be the fastest growing field of application for IPD protection components in the next five years. RF IPDs are also growing, with a CAGR of ~17% expected in the next 5 years. Next generation RF (such as UWB, ZigBee, LTE, etc…) is the highest growth sub-sector, as RF IPD technology offers the best value proposition in terms of matching accuracy performance, miniaturization, flexible chip to package configuration and fastest time to market solution. Digital and Mixed Signal IPD is still a very small market space. This application has the potential to take-off once IPDs reach the density and electrical performance requirements of DC-DC converter modules and high performance 2.5D silicon digital interposer substrates. Ramp-up is likely to take-off in the 2013-2015 time frame for both applications.
Still, important commercialization opportunities exist for 'custom designed' IPDs in niche and specialty markets, such as medical pace-makers, camera-pills, smart-meters and high reliability applications such as automotive, power electronic, aerospace and defense applications.
TOP 3 PLAYERS HOLD ALMOST 60% OF THE MARKET: NXP, STMicroelectronics & ON SEMICONDUCTOR
Europe is still by far the largest geographical area for the production of thin-film IPDs with the support of STMicroelectronics (FR), NXP (NL), IPDiA (FR) and Infineon (DE).
Following is North America with an important number of power, analog and mixed signal semiconductor companies such as Texas Instruments (US), Semtech (US), MicroSemi (US), Littlefuse (US), Protek (US) and ON Semiconductor (US), which acquired two IPD companies recently: CMD (US) in 2009 for $108M and SDT (US) in 2010. On Semiconductor is now the third largest IPD company worldwide and is in the position to challenge well established European players STMicroelectronics (FR) and NXP (NL).
Japan may keep lagging because of the presence of the largest discrete IPD makers locally (Murata, Panasonic, Epcos-TDK, Kyocera, Taiyo-Yuden…) which are not yet aggressively pushing this technology in the market.
More and more packaging, assembly and test companies (also called 'OSATs'), STATS ChipPAC (SG), Amkor (KR) and SPIL (TW) have entered the IPD market through very different business models. Taiwan related activity is set to increase significantly in the next few years with the entrance of ASE (TW) and TSMC (TW) into this business
MANY KEY TECHNOLOGIES IN THE STARTING BLOCKS OF THIS INDUTRY'S ROADMAP
In terms of component structures and materials, different evolutions are expected in the thin-film IPD technology roadmap. New inductor technologies will enable ever higher integration densities and Q-factor. New capacitor technologies such as 3D trenches will break out the 500nF/mm2 density challenges and enable new applications un-targetable before. New material depositions and techniques will be applied to get along with ferroelectric IPDs and meet with new ROHS regulations. New approaches, such as Paratek (US) acquired by RIM (CA), will be developed to build antenna tuner components for multi-band and multi-mode wireless products.
The importance of packaging has a strong impact on IPD technology. Several different evolutions are expected beyond the used of standard assembly techniques, including the emergence of TSV 'Through-Silicon-Vias' and TGV 'Through-Glass-Vias' interconnects, as well as Embedded chip in PCB and FOWLP type of packages
In terms of manufacturing infrastructure, a slow transition is happening: if the initial commercialization of IPD technology was supported by 150mm wafer fabs, 200mm is today the main infrastructure supporting recent IPD technology commercialization. Many 8'' factories are now in operations, such as STMicroelectronics (FR) in Tours, NXP (NL) in Hamburg Germany, ON Semiconductor (US) in Arizona, STATS ChiPAC (SG) in Woodland, and in Taiwan ASE and TSMC. It is becoming clear that at some point, a larger infrastructure on 300mm will be needed to support the commercialization of this technology, as cost pressure and volume adoption increases and IPDs are penetrating further the wireless consumer market.
KEY FEATURES OF THE REPORT
• 4 applications fields investigated (ESD/EMI protection, HB-LED ESD / TVS protection, RF and Digital & Mixed signal IPD)• Market trends and figures provided both in $M, Munits and wafer size equivalent• Technology roadmap and complete technologies and material tool-box analysis• 30 detailed company profiles of key thin-film IPD players (320+ slides PPT)
This new study exhaustively lists the existing and upcoming technologies and applications for IPDs. The report describes the thin-film IPD market, growth opportunities and the associated technologies deep inside each application.
Each market sub-segment is exhaustively detailed with:• Drivers and benefits of IPDs• Sub-segment size and expected growth rate• Value chain analysis• Global market evaluation per application: volume in units, wafers, and market size ($).• Evaluation of the major market players (market share)• Key thin-film IPD product detailed teardown analysis
COMPANIES CITED IN THIS REPORT
Aiconn, AMD, Amkor, Analog Devices, Apple, apm, ASE, Avago, AVX, AzureWave, Broadcom, Bourns, Bridgelux, CMD, Cree, CSR / Samsung, Energy Micro, Epcos – TDK, Kyocera, Fairchild Semi, Flip-Chip International, Fraunhofer-IZM institute, Freescale, Fujikura, Fujitsu, Gemtek, Icera / nVidia, Ibiden, IBM, IMEC, Infineon, IPDiA, Ibiden, IME, IMEC, Intel, ITRI, Qualcomm - Atheros, Leti, Littlefuse, LG Innotek, Lumileds, Maxim IC, Microsemi, Murata / SyChip, Nichia, NEPES, Nokia, Nordic Semiconductor, NXP, OnChip Devices, ON Semiconductor, Panasonic, Panjit Semiconductor, Paratek, ProTek Devices, Renesas, RFMD, RIM, Samsung, Sequans Communications, Shinko, Silex Microsystems, SiGe Semiconductor, Skyworks, Semtech, StatsChipPAC, STEricsson, STMicroelectronics, Sony, SPIL, Transfer Jet, Telephus / SEMCO, Taiyo Yuden, Texas Instruments, Touch Microsystems Technology, TSMC, Toshiba, Triquint, Tyndall, USI, Viking Tech, Vishay, Wavenics, Wi2wi, Wispry, Zarlink and more…Objectives of the Study p 5
Introduction, Definitions & Scope of the Report p 11
• Overview of discrete versus integrated passive solutions
• Integrated active and passive structure definitions (inductor, capacitor, resistors, diodes, combinations…)
• Comparison between thin-film / thick film IPD technologies (including ceramic LTCC)
• Executive summary
Thin-Film IPD Applications and Market Drivers p 40• ESD/EMI protection• LED Lighting protections• RF IPD• Digital & Mixed Signal IPD• For each category, you will find the analysis of- IPD current and future applications- IPD benefits and market driver descriptions for each IPD function and application- IPD functionalities by category
Thin-Film IPD Market Status & 2011-2017 Forecasts p 142
• IPD market forecasts are provided both in $M, Munits and in wafer eq. with attached CAGR p 143
- Volume shipments for IPD by application (cell-phone, mp3 players, medical, automotive…)
- IPD shipments by category (ESD/EMI protection, LED silicon submount, RF IPDs, Digital & Mixed signal IPDs)
- Specific applicative breakdown and forecast evolution for each category
- IPD shipments by substrate type (Silicon, Glass,…) and wafer size (6" / 8" / 12")
- IPD shipments by integration choice (discrete, Above IC, SiP package…)
- IPD shipments by packaging platform (WLP, Wire bond, Flip-chip, Embedded, Silicon submount, 3D TSV interposer, Fan-Out plastic laminate…)
Thin-Film IPD Supply Chain & Players p 175• Geographical mapping of different players p 176• IPD player market shares and revenues p 177- "Top 10" IPD players' 2008 revenues- Market share breakdown for ESD/EMI protection and RF IPD applications• Business model analysis for IPD• Summary of IPD player capabilities
Thin -Film IPD Technologies p198
• Overall IPD Technology roadmap p199
• IPD technology requirements & options p 204
- Performance and integration capabilities
- Inductors (multilayer planar inductors, 3D inductors…)
- Capacitors (planar versus trench geometries, SiO2 versus SiN versus BST versus PZT capacitors…)
• IPD Manufacturing challenges and related equipment & material tool-box p 225
- Substrate choice technology comparisons:
- Dielectric layer options (low k / high k)
- Trend for ferroelectric IPDs
- Available photoresists, oxide and other layer solutions, impact of layer thickness
- Metallic layer formation (Al, Copper, Gold…)
- Process options (line width, multiple layer IPDs, lithographic versus non lithographic patterning, advanced depositions…)
• IPD Design, Simulation and predictability through system level co-design p 244
Thin-Film IPD Architecture, Assembly & Packaging p 249• Integration, packaging and assembly platforms options for IPDs• Through-Silicon-Via manufacturing: a necessary step to reach the 3rd dimension• Fan-Out Wafer level packaging and embedded die technologies
Conclusions & Perspectives p 289
Email: [email protected]
Intl: +1 805-652-2626
In his session at @ThingsExpo, Chris Klein, CEO and Co-founder of Rachio, will discuss next generation communities that are using IoT to create more sustainable, intelligent communities. One example is Sterling Ranch, a 10,000 home development that – with the help of Siemens – will integrate IoT technology into the community to provide residents with energy and water savings as well as intelligent security. Everything from stop lights to sprinkler systems to building infrastructures will run ef...
Apr. 29, 2016 11:30 AM EDT Reads: 419
You deployed your app with the Bluemix PaaS and it's gaining some serious traction, so it's time to make some tweaks. Did you design your application in a way that it can scale in the cloud? Were you even thinking about the cloud when you built the app? If not, chances are your app is going to break. Check out this webcast to learn various techniques for designing applications that will scale successfully in Bluemix, for the confidence you need to take your apps to the next level and beyond.
Apr. 29, 2016 11:15 AM EDT Reads: 1,400
Manufacturers are embracing the Industrial Internet the same way consumers are leveraging Fitbits – to improve overall health and wellness. Both can provide consistent measurement, visibility, and suggest performance improvements customized to help reach goals. Fitbit users can view real-time data and make adjustments to increase their activity. In his session at @ThingsExpo, Mark Bernardo Professional Services Leader, Americas, at GE Digital, will discuss how leveraging the Industrial Interne...
Apr. 29, 2016 10:00 AM EDT Reads: 1,095
Whether your IoT service is connecting cars, homes, appliances, wearable, cameras or other devices, one question hangs in the balance – how do you actually make money from this service? The ability to turn your IoT service into profit requires the ability to create a monetization strategy that is flexible, scalable and working for you in real-time. It must be a transparent, smoothly implemented strategy that all stakeholders – from customers to the board – will be able to understand and comprehe...
Apr. 29, 2016 09:30 AM EDT Reads: 965
Increasing IoT connectivity is forcing enterprises to find elegant solutions to organize and visualize all incoming data from these connected devices with re-configurable dashboard widgets to effectively allow rapid decision-making for everything from immediate actions in tactical situations to strategic analysis and reporting. In his session at 18th Cloud Expo, Shikhir Singh, Senior Developer Relations Manager at Sencha, will discuss how to create HTML5 dashboards that interact with IoT devic...
Apr. 29, 2016 09:00 AM EDT Reads: 795
The increasing popularity of the Internet of Things necessitates that our physical and cognitive relationship with wearable technology will change rapidly in the near future. This advent means logging has become a thing of the past. Before, it was on us to track our own data, but now that data is automatically available. What does this mean for mHealth and the "connected" body? In her session at @ThingsExpo, Lisa Calkins, CEO and co-founder of Amadeus Consulting, will discuss the impact of wea...
Apr. 29, 2016 08:45 AM EDT Reads: 574
There is an ever-growing explosion of new devices that are connected to the Internet using “cloud” solutions. This rapid growth is creating a massive new demand for efficient access to data. And it’s not just about connecting to that data anymore. This new demand is bringing new issues and challenges and it is important for companies to scale for the coming growth. And with that scaling comes the need for greater security, gathering and data analysis, storage, connectivity and, of course, the...
Apr. 29, 2016 08:45 AM EDT Reads: 570
Digital payments using wearable devices such as smart watches, fitness trackers, and payment wristbands are an increasing area of focus for industry participants, and consumer acceptance from early trials and deployments has encouraged some of the biggest names in technology and banking to continue their push to drive growth in this nascent market. Wearable payment systems may utilize near field communication (NFC), radio frequency identification (RFID), or quick response (QR) codes and barcodes...
Apr. 29, 2016 08:30 AM EDT Reads: 572
SYS-CON Events announced today that DatacenterDynamics has been named “Media Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY. DatacenterDynamics is a brand of DCD Group, a global B2B media and publishing company that develops products to help senior professionals in the world's most ICT dependent organizations make risk-based infrastructure and capacity decisions.
Apr. 29, 2016 05:45 AM EDT Reads: 2,402
SYS-CON Events announced today TMCnet has been named “Media Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Technology Marketing Corporation (TMC) is the world's leading business-to-business and integrated marketing media company, servicing niche markets within the com...
Apr. 29, 2016 04:45 AM EDT Reads: 2,344
The IoT has the potential to create a renaissance of manufacturing in the US and elsewhere. In his session at 18th Cloud Expo, Florent Solt, CTO and chief architect of Netvibes, will discuss how the expected exponential increase in the amount of data that will be processed, transported, stored, and accessed means there will be a huge demand for smart technologies to deliver it. Florent Solt is the CTO and chief architect of Netvibes. Prior to joining Netvibes in 2007, he co-founded Rift Technol...
Apr. 28, 2016 07:00 PM EDT Reads: 1,486
Join IBM June 8 at 18th Cloud Expo at the Javits Center in New York City, NY, and learn how to innovate like a startup and scale for the enterprise. You need to deliver quality applications faster and cheaper, attract and retain customers with an engaging experience across devices, and seamlessly integrate your enterprise systems. And you can't take 12 months to do it.
Apr. 28, 2016 04:45 PM EDT Reads: 1,740
This is not a small hotel event. It is also not a big vendor party where politicians and entertainers are more important than real content. This is Cloud Expo, the world's longest-running conference and exhibition focused on Cloud Computing and all that it entails. If you want serious presentations and valuable insight about Cloud Computing for three straight days, then register now for Cloud Expo.
Apr. 28, 2016 04:30 PM EDT Reads: 1,628
IoT device adoption is growing at staggering rates, and with it comes opportunity for developers to meet consumer demand for an ever more connected world. Wireless communication is the key part of the encompassing components of any IoT device. Wireless connectivity enhances the device utility at the expense of ease of use and deployment challenges. Since connectivity is fundamental for IoT device development, engineers must understand how to overcome the hurdles inherent in incorporating multipl...
Apr. 28, 2016 02:45 PM EDT Reads: 1,373
Machine Learning helps make complex systems more efficient. By applying advanced Machine Learning techniques such as Cognitive Fingerprinting, wind project operators can utilize these tools to learn from collected data, detect regular patterns, and optimize their own operations. In his session at 18th Cloud Expo, Stuart Gillen, Director of Business Development at SparkCognition, will discuss how research has demonstrated the value of Machine Learning in delivering next generation analytics to im...
Apr. 28, 2016 02:30 PM EDT Reads: 1,568
The paradigm has shifted. A Gartner survey shows that 43% of organizations are using or plan to implement the Internet of Things in 2016. However, not just a handful of companies are still using the old-style ad-hoc trial-and-error ways, unaware of the critical barriers, paint points, traps, and hidden roadblocks. How can you become a winner? In his session at @ThingsExpo, Tony Shan will present a methodical approach to guide the holistic adoption and enablement of IoT implementations. This ov...
Apr. 28, 2016 01:00 PM EDT Reads: 1,514
SYS-CON Events announced today that Stratoscale, the software company developing the next generation data center operating system, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Stratoscale is revolutionizing the data center with a zero-to-cloud-in-minutes solution. With Stratoscale’s hardware-agnostic, Software Defined Data Center (SDDC) solution to store everything, run anything and scale everywhere...
Apr. 28, 2016 12:45 PM EDT Reads: 1,464
Angular 2 is a complete re-write of the popular framework AngularJS. Programming in Angular 2 is greatly simplified – now it's a component-based well-performing framework. This immersive one-day workshop at 18th Cloud Expo, led by Yakov Fain, a Java Champion and a co-founder of the IT consultancy Farata Systems and the product company SuranceBay, will provide you with everything you wanted to know about Angular 2.
Apr. 28, 2016 12:15 PM EDT Reads: 1,615
SYS-CON Events announced today that Men & Mice, the leading global provider of DNS, DHCP and IP address management overlay solutions, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. The Men & Mice Suite overlay solution is already known for its powerful application in heterogeneous operating environments, enabling enterprises to scale without fuss. Building on a solid range of diverse platform support,...
Apr. 28, 2016 11:30 AM EDT Reads: 2,186
So, you bought into the current machine learning craze and went on to collect millions/billions of records from this promising new data source. Now, what do you do with them? Too often, the abundance of data quickly turns into an abundance of problems. How do you extract that "magic essence" from your data without falling into the common pitfalls? In her session at @ThingsExpo, Natalia Ponomareva, Software Engineer at Google, will provide tips on how to be successful in large scale machine lear...
Apr. 28, 2016 10:00 AM EDT Reads: 733