Welcome!

Wearables Authors: Liz McMillan, Stackify Blog, William Schmarzo, Carmen Gonzalez, Elizabeth White

News Feed Item

HyperX Releases ‘Impact’ SO-DIMMs, FURY SSD, White Headset and Mouse Pad at COMPUTEX TAIPEI

COMPUTEX TAIPEI 2014, Kelti International Building 14F -- HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the launch of HyperX Impact memory for gamers and enthusiasts who want to upgrade and boost performance in their laptops and small form factor PCs. HyperX Impact replaces the current SO-DIMM offerings under Genesis, PnP and LoVo into one family.

HyperX Impact achieved a world record for the fastest SO-DIMM frequency running at 2666MHz. A video of that performance can be seen here. HyperX Impact is available in frequencies ranging from 1600MHz to an industry-fastest 2400MHz in capacities of 4GB and 8GB single modules and 8GB to 16GB kits of 2. Voltages start at 1.35V and upgrading is effortless as Plug and Play (PnP) functionality is designed into every module to automatically overclock within the system speed allowance without manual tuning. HyperX Impact can also be used to upgrade small form factor systems such as the Gigabyte BRIX, Intel NUC and ZOTAC ZBOX.

For entry-level gamers, HyperX FURY SSD features locked synchronous NAND and is powered by the LSI SandForce SF-2281 controller with SATA Rev 3.0 (6GB/s) performance. The new, entry-level solid-state drive offers exceptional read/write speeds of 500/500MB/s and is ideal for quicker boot times, application loading and file execution. It is available in 120GB and 240GB capacities. HyperX FURY SSD is the latest addition to the HyperX FURY family as it joins the recently released HyperX FURY DRAM.

HyperX FURY SSD is available as a standalone drive with an included 7mm to 9.5mm adapter. It is backed by a three-year warranty, free live technical support and legendary HyperX reliability.

HyperX also announces the following at COMPUTEX TAIPEI:

  • “HOT” HyperX OC Takeover competition. Overclockers from around the world will compete for $10,000 (USD) in total prize money for the top marks in Maximum Memory Frequency, SuperPi 32M and XTU with a secret processor to be revealed at the event. Following Taiwan, HyperX will stage four regional online HOT tournaments on hwbot.org to lead up to a $15,000 (USD) World Finals held at 2015 International CES®.
  • A preview of the forthcoming special White Edition HyperX Cloud headset that features the same award-winning comfort of the black HyperX Cloud, but with white ear cups and stitching.
  • HyperX Skyn: A paper-thin hard mouse pad with an adhesive bottom to stick to a desk, yet removable with a lift of a tab on the side. HyperX Skyn comes in a package of two. One mouse pad creates a surface to give the gamer more control for accuracy while another allows increased speed for fast moving action.

“We are happy to launch the fastest SO-DIMMs in the world to increase performance in notebooks, small form factor PCs and other machines,” said Lawrence Yang, business manager, HyperX. “The White Cloud headset and new mouse pad shows our commitment to the gaming and eSports community. For overclockers, HyperX set the world record at 4415MHz and we hope to even go higher this year with our HOT competitions.”

HyperX is the high-performance product division of Kingston Technology encompassing high-speed DDR3 memory, SSDs, USB Flash drives, and headsets. Targeted at gamers, overclockers and enthusiasts, HyperX is known throughout the world for quality, performance and innovation. HyperX is committed to eSports as it sponsors over 20 teams globally and is the main sponsor of Intel Extreme Masters. HyperX can be found at many shows including Brasil Game Show, China Joy, DreamHack and PAX.

For more information visit the HyperX home page.

HyperX Impact Memory Features and Specifications:

  • Capacities: 4GB, 8GB (single) and 8GB, 16GB (kits)
  • Frequency: (speed) 1600MHz–2400MHz
  • Channel Architecture: Dual Channel
  • Latency: CL9-CL12
  • Voltage: 1.35V
  • Operating Temperature: 0°C to 85°C
  • Storage Temperature: -55°C to 100°C
  • Dimensions: 68.1mm x 30.45mm
  • Chipsets Compatible: with HM65, HM67, HM70, HM75, HM76, HM77, HM86, HM87, QM67, QM87, QS67, UM67 and UM77 Intel chipsets
  HyperX Impact
Part Number   Capacity and Features
HX316LS9IB/4   4GB 1600Mhz DDR3 Non-ECC CL9 SO DIMM 1.35V HyperX Impact
HX316LS9IBK2/8   8GB 1600Mhz DDR3 Non-ECC CL9 SO DIMM (Kit of 2) 1.35V HyperX Impact
HX316LS9IB/8   8GB 1600Mhz DDR3 Non-ECC CL9 SO DIMM 1.35V HyperX Impact
HX316LS9IBK2/16   16GB 1600Mhz DDR3 Non-ECC CL9 SO DIMM (Kit of 2) 1.35V HyperX Impact
HX318LS10IBK2/8   8GB 1866Mhz DDR3 Non-ECC CL10 SO DIMM (Kit of 2) 1.35V HyperX Impact
HX318LS10IBK2/16   16GB 1866Mhz DDR3 Non-ECC CL10 SO DIMM (Kit of 2) 1.35V HyperX Impact
HX321LS11IBK2/8   8GB 2133Mhz DDR3 Non-ECC CL11 SO DIMM (Kit of 2) 1.35V HyperX Impact
HX321LS11IBK2/16   16GB 2133Mhz DDR3 Non-ECC CL11 SO DIMM (Kit of 2) 1.35V HyperX Impact
HX324LS12IBK2/8   8GB 2400Mhz DDR3 Non-ECC CL12 SO DIMM (Kit of 2) 1.35V HyperX Impact5
HX324LS12IBK2/16   16GB 2400Mhz DDR3 Non-ECC CL12 SO DIMM (Kit of 2) 1.35V HyperX Impact5

HyperX Impact Part Number Decoder: HX3=(Frequency); LS=(Low Voltage SO-DIMM); CAS Latency Number); IB=Impact Black PCB; K2=Kit of 2/Total Gigabyte Capacity

HyperX FURY SSD Features and Specifications:

  • Form factor: 2.5"
  • Interface: SATA Rev. 3.0 (6Gb/s) with backwards compatibility to SATA Rev. 2.0
  • Capacities1: 120GB, 240GB
  • Baseline Performance2: Compressible Data Transfer (ATTO)
  • All capacities: 500MB/s Read and 500MB/s Write
  • Incompressible Data Transfer (AS-SSD and CrystalDiskMark)
    • 120GB : 330MB/s Read and 130MB/s Write
    • 240GB : 390MB/s Read and 250MB/s Write
  • IOMETER Maximum Random 4k Read/Write
    • 120GB: up to 72,500/ up to 79,000 IOPS
    • 240GB: up to 72,500/ up to 79,000 IOPS
  • PCMark® Vantage HDD Suite Score
    • 120GB: 60,000
    • 240GB: 60,000
  • PCMark 8 Storage Bandwidth
    • 120GB: 133.36 MB/s
    • 240GB: 183.18 MB/s
  • Power Consumption
    • 0.31 W Idle / 0.35 W Avg. / 1.65 W (MAX) Read / 2.76 W (MAX) Write
  • Storage temperature: -40°C ~ 85°C
  • Operating temperature: 0°C ~ 70°C
  • Dimensions: 69.8mm x 100.1mm x 7mm
  • Weight: 86g
  • Vibration operating: 2.17G Peak (7–800Hz)
  • Vibration non-operating: 20G Peak (10–2000Hz)
  • Life expectancy: 1 million hours MTBF
  • Warranty/support: three-year warranty with free technical support
  • Total Bytes Written (TBW) 3
    • 120GB: 315TB 2 DWPD4
    • 240GB: 641TB 2 DWPD4

1 Some of the listed capacity on a Flash storage device is used for formatting and other functions and thus is not available for data storage. As such, the actual available capacity for data storage is less than what is listed on the products. For more information, go to Kingston’s Flash memory Guide at kingston.com/flashguide.
2 Based on “out-of-box performance” using a SATA Rev. 3.0 motherboard. Speed may vary due to host hardware, software, and usage. IOMETER Random 4k Random Read/Write is based on 8GB partition.
3 Total Bytes Written (TBW) is derived from the JEDEC Workload (JESD219A).
4 Drives Writes Per Day (DWPD)
5 Coming soon

  HyperX FURY SSD
Part Number   Description
SHFS37A/120G   120GB stand-alone SSD
SHFS37A/240G   240GB stand-alone SSD
 

HyperX Cloud White Edition Features and Specifications:

  • Colors: White, Black
  • Transducer Type: dynamic Ø 53mm
  • Operating Principle: closed
  • Frequency Response: 15Hz–25,000 Hz
  • Nominal Impedance: 60 Ω per system
  • Nominal SPL: 98±3dB
  • T.H.D.: < 2%
  • Power Handling Capacity: 150mW
  • Sound Coupling To The Ear: circumaural
  • Ambient Noise Attenuation: approx. 20dBa
  • Headband Pressure: 5N
  • Weight With Microphone And Cable: 350g
  • Cable Length And Type: 1m + 2m extension + 10cm iPhone
  • Connection: mini stereo jack plug (3.5 mm)

Microphone:

  • Transducer Type: condenser (back electret)
  • Operating Principle: pressure gradient
  • Polar Pattern: cardioid
  • Power Supply: AB powering
  • Supply Voltage: 2V
  • Current Consumption: max 0.5 mA
  • Nominal Impedance: ≤2.2 kΩ
  • Open Circuit Voltage: at f = 1 kHz: 20 mV / Pa
  • Frequency Response: 100–12,000 Hz
  • THD: 2% at f = 1 kHz
  • Max. SPL: 105dB SPL (THD≤1.0% at 1 KHz)
  • Microphone Output: -39±3dB
  • Length Mic Boom: 150mm (include gooseneck)
  • Capsule Diameter: Ø6*5 mm
  • Connection: mini stereo jack plug (3.5mm)

HyperX can be found on:
YouTube: http://www.youtube.com/kingstonhyperx
Facebook: http://www.facebook.com/hyperxcommunity
Twitter: http://twitter.com/hyperx
LinkedIn: http://www.linkedin.com/company/164609?trk=tyah
Google+: https://plus.google.com/u/0/+kingston/posts

About HyperX
HyperX® is a division of Kingston Technology Company, Inc., the world’s largest independent memory manufacturer. Established in 2002, HyperX is headquartered in Fountain Valley, California, USA. For more information, please call 800-337-8410 or visit www.kingston.com/us/memory/hyperx.

Editor’s Note: For additional information, evaluation units or executive interviews, please contact David Leong, Kingston Digital, Inc. 17600 Newhope Street, Fountain Valley, CA USA 92708, 714-438-1817 (Voice). Press images can be found in Kingston’s press room at kingston.com/press/default.asp

Kingston, the Kingston logo and HyperX are registered trademarks of Kingston Technology Corporation. All rights reserved. All other marks may be the property of their respective titleholders.

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
SYS-CON Events announced today that Peak 10, Inc., a national IT infrastructure and cloud services provider, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Peak 10 provides reliable, tailored data center and network services, cloud and managed services. Its solutions are designed to scale and adapt to customers’ changing business needs, enabling them to lower costs, improve performance and focus intern...
SYS-CON Events announced today that Progress, a global leader in application development, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Enterprises today are rapidly adopting the cloud, while continuing to retain business-critical/sensitive data inside the firewall. This is creating two separate data silos – one inside the firewall and the other outside the firewall. Cloud ISVs ofte...
SYS-CON Events announced today that Systena America will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Systena Group has been in business for various software development and verification in Japan, US, ASEAN, and China by utilizing the knowledge we gained from all types of device development for various industries including smartphones (Android/iOS), wireless communication, security technology and IoT serv...
DevOps at Cloud Expo – being held October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA – announces that its Call for Papers is open. Born out of proven success in agile development, cloud computing, and process automation, DevOps is a macro trend you cannot afford to miss. From showcase success stories from early adopters and web-scale businesses, DevOps is expanding to organizations of all sizes, including the world's largest enterprises – and delivering real r...
SYS-CON Events announced today that Hitachi Data Systems, a wholly owned subsidiary of Hitachi LTD., will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City. Hitachi Data Systems (HDS) will be featuring the Hitachi Content Platform (HCP) portfolio. This is the industry’s only offering that allows organizations to bring together object storage, file sync and share, cloud storage gateways, and sophisticated search and...
The 21st International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Digital Transformation, Machine Learning and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding busin...
SYS-CON Events announced today that Technologic Systems Inc., an embedded systems solutions company, will exhibit at SYS-CON's @ThingsExpo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Technologic Systems is an embedded systems company with headquarters in Fountain Hills, Arizona. They have been in business for 32 years, helping more than 8,000 OEM customers and building over a hundred COTS products that have never been discontinued. Technologic Systems’ pr...
SYS-CON Events announced today that Carbonite will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Carbonite protects your entire IT footprint with the right level of protection for each workload, ensuring lower costs and dependable solutions with DoubleTake and Evault.
New competitors, disruptive technologies, and growing expectations are pushing every business to both adopt and deliver new digital services. This ‘Digital Transformation’ demands rapid delivery and continuous iteration of new competitive services via multiple channels, which in turn demands new service delivery techniques – including DevOps. In this power panel at @DevOpsSummit 20th Cloud Expo, moderated by DevOps Conference Co-Chair Andi Mann, panelists will examine how DevOps helps to meet th...
SYS-CON Events announced today that Progress, a global leader in application development, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Enterprises today are rapidly adopting the cloud, while continuing to retain business-critical/sensitive data inside the firewall. This is creating two separate data silos – one inside the firewall and the other outside the firewall. Cloud ISVs oft...
SYS-CON Events announced today that CollabNet, a global leader in enterprise software development, release automation and DevOps solutions, will be a Bronze Sponsor of SYS-CON's 20th International Cloud Expo®, taking place from June 6-8, 2017, at the Javits Center in New York City, NY. CollabNet offers a broad range of solutions with the mission of helping modern organizations deliver quality software at speed. The company’s latest innovation, the DevOps Lifecycle Manager (DLM), supports Value S...
SYS-CON Events announced today that Cloudistics, an on-premises cloud computing company, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloudistics delivers a complete public cloud experience with composable on-premises infrastructures to medium and large enterprises. Its software-defined technology natively converges network, storage, compute, virtualization, and management into a ...
SYS-CON Events announced today that Ocean9will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Ocean9 provides cloud services for Backup, Disaster Recovery (DRaaS) and instant Innovation, and redefines enterprise infrastructure with its cloud native subscription offerings for mission critical SAP workloads.
Multiple data types are pouring into IoT deployments. Data is coming in small packages as well as enormous files and data streams of many sizes. Widespread use of mobile devices adds to the total. In this power panel at @ThingsExpo, moderated by Conference Chair Roger Strukhoff, panelists will look at the tools and environments that are being put to use in IoT deployments, as well as the team skills a modern enterprise IT shop needs to keep things running, get a handle on all this data, and deli...
We build IoT infrastructure products - when you have to integrate different devices, different systems and cloud you have to build an application to do that but we eliminate the need to build an application. Our products can integrate any device, any system, any cloud regardless of protocol," explained Peter Jung, Chief Product Officer at Pulzze Systems, in this SYS-CON.tv interview at @ThingsExpo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm.
SYS-CON Events announced today that Infranics will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Since 2000, Infranics has developed SysMaster Suite, which is required for the stable and efficient management of ICT infrastructure. The ICT management solution developed and provided by Infranics continues to add intelligence to the ICT infrastructure through the IMC (Infra Management Cycle) based on mathemat...
SYS-CON Events announced today that HTBase will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. HTBase (Gartner 2016 Cool Vendor) delivers a Composable IT infrastructure solution architected for agility and increased efficiency. It turns compute, storage, and fabric into fluid pools of resources that are easily composed and re-composed to meet each application’s needs. With HTBase, companies can quickly prov...
Internet of @ThingsExpo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with the 21st International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. @ThingsExpo Silicon Valley Call for Papers is now open.
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...